TLX-9 2-Layer PCB: High-Performance Circuit Boards for Advanced Applications
1.Introduction to TLX-9
TLX-9 is a state-of-the-art composite made from PTFE and woven glass laminates, known for its exceptional electrical and mechanical properties. This material is highly suitable for various manufacturing methods, including shearing, drilling, milling, and plating, making it versatile in PCB applications. TLX-9 laminates offer dimensional stability and minimal moisture absorption during fabrication, ensuring high performance and reliability for electronic devices.
2. Features
Dielectric Constant: 2.5 at 10 GHz
Dissipation Factor: 0.0019 at 10 GHz
Moisture Absorption: Less than 0.02%
Dielectric Breakdown: Greater than 60 kV
Volume Resistivity: 10^7 Mohm/cm
Surface Resistivity: 10^7 Mohm
Arc Resistance: Over 180 seconds
Flexural Strength: Lengthwise over 23,000 lbs/in; crosswise over 19,000 lbs/in
Peel Strength: 12 lbs/linear inch for 1 oz copper
Thermal Conductivity: 0.19 W/m/K
Coefficient of Thermal Expansion (CTE): 9-12 ppm/°C (x-y), 130-145 ppm/°C (z)
UL-94 Flammability Rating: V-0
3. PCB Construction Details
汽水| Specification | Details |
| Base Material | TLX-9 |
| Layer Count | 2 layers |
| Board Dimensions | 78mm x 39mm (1 PCS), ± 0.15mm |
| Minimum Trace/Space | 4/7 mils |
| Minimum Hole Size | 0.25mm |
| Blind Vias | None |
| Finished Board Thickness | 0.9mm |
| Finished Copper Weight | 1 oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% electrical test prior to shipment |
4. PCB Stackup
汽水| Specification | Details |
| Copper Layer 1 | 35 µm |
| Taconic TLX-9 Core | 0.787 mm (31 mil) |
| Copper Layer 2 | 35 µm |
5.PCB Statistics
Components: 16
Total Pads: 36
Through Hole Pads: 25
Top SMT Pads: 11
Bottom SMT Pads: 0
Vias: 23
Nets: 2
6.Manufacturing & Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping
7.Benefits
Low Dielectric Constant
Low Dissipation Factor
Minimal Moisture Absorption
High Dielectric Breakdown
Excellent Peel Strength
Controlled Coefficient of Thermal Expansion (CTE)
8.Typical Applications
LNAs, LNBs, and LNCs
Personal Communications Service / Personal Communications Network (PCS/PCN)
Large Format Antennas
High Power Amplifiers
Passive Components
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